Media > Realtek Showcases Next-Generation Connectivity and HDT Audio Platforms at Embedded World 2026

Realtek Semiconductor Corporation successfully concluded its participation at Embedded World 2026, presenting a comprehensive portfolio of intelligent connectivity, Bluetooth, and HDT audio solutions for smart home, industrial, mobility, retail, audio, and IoT applications. Across three days of demonstrations and customer engagements, Realtek highlighted how its platforms enable an AI-driven, highly connected future while helping device makers reduce time to market.

The centerpiece of the booth was Realtek's Bluetooth HDT (High Data Throughput) platform. Live demonstrations of the RTL8922D, the world's first HDT combo chip, and the RTL8773J, the world's first HDT audio SoC, showcased an enhanced packet and scheduling architecture that delivers 80–90 percent on-air utilization, multi-stream audio with low latency and low jitter, and supports ~10 ms gaming sound, 7.1 channel surround, hi-res music, high fidelity microphones, and faster OTA updates, providing wireless performance that closely approaches a 'wired-like' experience. Realtek also featured its Bluetooth LE MCU RTL8762J for healthcare and gaming, paired with the RTL8773J in an integrated 'all in one' architecture delivering low latency, high reliability wireless links and superior audio performance for next generation gaming headsets, high performance HID peripherals, and medical and wellness devices.

Beyond Bluetooth HDT, Realtek showcased solutions for key application domains. In smart home, the RTL8772GWP based Thread Open Thread Border Router (OTBR), the world's first Ethernet interface Thread OTBR, supports Matter over Thread with Ethernet and Wi-Fi backhaul, enabling upgrades of existing Wi-Fi access points and OTT boxes into Matter hubs without hardware changes and helping service providers and device makers cost-effectively upgrade deployed equipment. For human–machine interfaces (HMI), the RTL8772GWP based Smart HMI knob display with a 2.1 inch circular OLED and support for Bluetooth LE, Mesh, Thread, and OTBR delivers high resolution rotary and touchscreen control with low latency wireless connectivity. In smart retail, the RTL8752H based ESL Access Point and tag platform supports Bluetooth LE, IEEE 802.15.4, and proprietary 2.4 GHz modes, offering high RF performance, ultra low power consumption, and concurrent operation optimized for high density ESL deployments to reduce operating costs and enhance store digitalization.

For vehicle and micro mobility, Realtek presented an all in one smart cluster solution based on the RTL8782FWP and RTL8763ESE, integrating Wi-Fi 6, Bluetooth audio, MCU processing, graphics, and DSP to enable smartphone mirroring, dual helmet audio sharing, intercom, keyless access, and vehicle data integration, addressing the growing demand for connected, intelligent experiences in electric scooters, motorcycles, and other light vehicles. An audio mesh intercom solution using SoCs such as RTL8763E, RTL8773D, and RTL87x3J demonstrated long range, low latency group communication. Realtek also showcased its Zephyr SDK for RTL87x2G, RTL8752H, and RTL87x3G, with Zephyr v3.7 LTS compatibility and a roadmap toward Zephyr v4.4, supported by reference designs including a Bluetooth mesh platform, a mechanical keyboard, and a smartwatch evaluation board to simplify development of wearables, mesh devices, keyboards, and other IoT products and shorten time from concept to production.

Realtek's presence at Embedded World 2026 underscored its role as a leading enabler of intelligent, connected systems, offering tightly integrated silicon, software, and reference designs that accelerate development and scale AI-ready products. The company thanks all customers, partners, and visitors for their engagement and remains committed to advancing high performance connectivity and Bluetooth technologies for the next generation of smart home, healthcare, gaming, mobility, and IoT solutions, contributing to a more intelligent, connected future.