Realtek has officially launched the first universal SDK (v3.14.0.39) specifically designed for the RTL87x3D series Bluetooth chips. The RTL87x3D series is a single-chip Bluetooth audio solution that integrates an MCU and DSP, utilizing the latest Bluetooth® Core Specification v5.4 protocol. It achieves superior performance through an ARM Cortex-M4 core and two ultra-low-power DSP cores. The chip is equipped with Hi-Fi Mini for voice and audio codec functions, and Hi-Fi 4 to support high-performance signal processing and software neural network libraries.

Chip Features

- High-Performance Interfaces: Includes an audio codec, power management unit, ADC, low-power RF transceiver, and intelligent I/O allocation controller.

- Optimized Audio Processing: The Programmable Arithmetic Logic Unit v2.0 (PALU v2.0) enables low-latency processing of less than 10 microseconds, suitable for audio pass-through and ANC applications.

- Enhanced Feature Set: Supports LE Audio with multi-connection synchronous streams and broadcast synchronous streams, compatible with Hearing Aid Profile (HAP) and Telephony and Media Audio Profile (TMAP).

SDK Support

The SDK comes with comprehensive API interfaces, a wealth of sample applications, and a variety of development and debugging tools, along with detailed online documentation. This provides developers with a straightforward and flexible development path. This solution not only ensures rapid and stable product development but also effectively reduces costs by optimizing the Bill of Materials (R-BOM), thereby securing a competitive edge for developers in the market.

This SDK and chip offer robust support for developers, facilitating advancements in the wireless connectivity field. Should you encounter any issues during use, please provide feedback through our online system or FAE channels. We look forward to collaborating with you to explore new possibilities in wireless connectivity.