Recently, the amount of Bluetooth devices that support A2DP source/ HFP capability has grown dramatically. Nowadays, most users might have multiple devices, such as mobile phones, tablets, soundbars, TV sets, game consoles, etc. (Please refer to Figure 1 / Figure 2.) Simultaneously, the TWS earbud is now the most popular audio/voice sink device. If solution vendors can provide an easier way of creating/maintaining connections and smoothly switching between source devices, it will end up helping users significantly. Thus, Multilink, called Multi-connection, became a mandatory capability in Earbud.

Realtek participated in the 2022 (Winter) Asia Smart Wearable Exhibit, showcasing the RTL8763EW, a Bluetooth smart wearable solution with awe-inspiring computing power, ultra-low power consumption, fine screen display, excellent mobile phone compatibility, and clear call effects, providing customers with the most comprehensive solution to their development needs.

Engineers responsible for e-Scooter and e-Bike dashboard interface design are focusing on two critical aspects: more effectively integrating smartphones with the dashboard and making BMS (Battery Management System) data readily available.

The Realtek RTL8762DK is an ultra-low power SOC (System-on-Chip) designed for Bluetooth 5.1 low-energy applications -- and an excellent option for a total solution that links allows wireless connection between a dashboard and smartphone while providing real-time data from the BMS.

The Bluetooth Special Interest Group (hereinafter referred to as the SIG) released the Auracast™ broadcast audio technology in July this year to promote the next-generation Bluetooth audio market. On November 15 this year, the IOTE 2022 · Shenzhen Bluetooth IoT Technologies and Innovative Applications Summit, co-organized by Ulink Media and the SIG, invited Bluetooth industry promoters from across the world to share the current status and future trends of the Bluetooth market, creating new application opportunities. Big companies such as Realtek Semiconductor Corp., Tuya Smart, and Nordic Semiconductor were invited by the Summit to discuss topics such as the application and trend of Bluetooth LE (Low Energy) in IoT audio, as well as the applications and innovation of Bluetooth Mesh in various industries.