The ASWE Asia Smart Wearable Exhibition was hosted by 52audio.com in Shenzhen, China. This year, the exhibition was in Hall 2 of the Shenzhen Convention and the Exhibition Center was in Shenzhen's Futian District. The Smart Wearable Exhibition is now in its fifth year. The exhibition drew in Bluetooth headset brands, manufacturers, solution providers and agents, with more than 50 speakers and 200 companies participating in the exhibition. Realtek also showcased Bluetooth headset and hearing aid solutions at the on-site corporate booth, such as a Bluetooth 5.3 Audio SoC with an AI ENC (RTL8753EFE), Bluetooth 5.3 Audio SoC with 3D sound effects & gaming mode (RTL8753BFE-VQ), Bluetooth 5.3 Audio SoC with ANC & BLE Audio (RTL8773ESL), Bluetooth 5.3 Audio SoC with BLE Audio (RTL8763EFL), etc. In addition to providing customers with a better understanding of the differences and advantages of these solutions, we also can procure potential customers.

In addition to our exhibitor booths, we also participated in the summits, namely the Asia Bluetooth Headset Conference and the Asia Assistive Listening Industry Conference. The theme of the Asia Bluetooth Headset Conference was “The Past, Present and Future of Bluetooth Headset,” introducing the BLE Audio chip platforms RTL8763E, RTL8773E and RTL8773D, while the Asia Hearing Aid Industry Conference theme was “Introduction to Realtek Hearing Aid Solutions,” introducing the hearing aid chip platforms, RTL8773CO and RTL8773DO.

Asia Bluetooth Headset Conference - The Past, Present and Future of Bluetooth Headsets

Realtek's Project Manager, Mr. Danchao He, gave a speech titled “Bluetooth Headsets - Past, Present and Future,” introducing each stage of Bluetooth development from 1994 down to the present. Realtek's Bluetooth headset solutions are constantly evolving as technology evolves, providing customers with a variety of stable solutions. Now it supports the latest LE Audio low-power Bluetooth audio and introduces Auracast™ broadcast audio innovation technology, introducing BLE Audio chip platforms - RTL8763E, RTL8773E and RTL8773D. RTL8763E and RTL8773E is a fast mass production LE Audio solution that supports LE Audio (Bluetooth 5.3) and full features announced by the Bluetooth Association, while the RTL8773D is the first Bluetooth AI chip with excellent features, such as a high performance AI platform and true adaptive ANC to expand the future of the Bluetooth headset market with customers.

Asia Hearing Aid Industry Conference - Realtek Hearing Aid Solution Presentation

There are currently 1.4 billion people worldwide who suffer from the inconvenience of hearing loss. After years of continuous technical improvements, people with moderate and mild hearing impairment will have the option to switch from hearing aids to Bluetooth headsets with TWS+ hearing aids for better sound quality, better call noise reduction and ANC. Realtek has also developed its own Real Hearing Aid - RHA hearing aid algorithm and launched the RTL8773CO and RTL8773DO hearing aid chips to create a crisp, clear and comfortable listening experience for people with hearing loss.