With the help of multimodal sensors like visual and aural ones, smart glasses — an inventive wearable technology that blends artificial intelligence (AI) with Internet of Things (IoT) technology — allow intelligent interaction and environmental observation. They offer practical and effective smart services for everyday situations, work, and study, supporting features like voice control, environmental data analysis, and picture recognition. They are the best option for upgrading one's own digital devices.
System Structure
Self-developed Wi-Fi (Wi-Fi SoC) and Bluetooth (Bluetooth SoC) chips are integrated into the Realtek smart glasses solution. These two core chips work together to provide exceptional performance and great integration. The Bluetooth SoC serves as the primary control unit for the system, handling audio processing in addition to hardware and software management. It effectively establishes Bluetooth connections with smartphones and other host devices, providing consumers with a rich interactive experience. High-speed wireless data transfer, multimedia storage, and picture capturing are the main functions of the Wi-Fi SoC. In order to facilitate future development, it also provides a number of standard interfaces for feature upgrades and system expansion.
Main Functional Modules:
With its highly integrated hardware architecture and a wealth of standard interfaces, this solution significantly improves development efficiency and product scalability. It flexibly adapts to various smart glasses application scenarios and effectively accelerates the mass production and market launch of smart terminal products.
Practical Application Case
In addition to supporting voice-controlled photography, the smart glasses with Realtek chips connect to a multimodal AI model on the mobile device for intelligent picture analysis. Voice feedback is used to deliver the recognition findings in real-time, giving users effective and practical scene perception support.
Application Scenarios
Advantages of Solution
Provides a one-stop solution to meet the functional requirements of IPs such as Wi-Fi SoC, Bluetooth SoC, and ISP. It enables efficient coexistence between Bluetooth and Wi-Fi, simplifies the integration process, and accelerates product time-to-market.
Rich MCU memory resources, powerful CPU computing capability, and easy extensibility for additional functions.
Powerful DSP computing capabilities ensure exceptional audio processing performance.
Supports interfaces such as GPIO/I2C/SPI/UART/ADC/DAC/MIC/I2S/SPIC, and can be externally connected to a wide range of devices.
Built around a Bluetooth SoC core, it integrates an RTOS and flexible power management to intelligently switch power supply modes, significantly extending battery life and achieving optimal low-power performance.
Fully-featured SDK, including a variety of product prototype projects and mobile APP SDK, OTA Tool, significantly reduces the design time and accelerates project mass production.
Related Chips
| RTL8773DO-VAI-CG | |
|---|---|
| MCU | ARM Cortex-M4F@160MHz |
| DSP | Tensilica HiFi mini@320MHz + Tensilica HiFi4@320MHz |
| Flash | MCM 16MB |
| SRAM | DSP + MCU total 3MB |
| Bluetooth Version | Bluetooth 5.4 |
| A-MIC Number | ×4 |
| D-MIC Number | ×6 |
| SPK/DAC | Class AB ×2 + Class D ×2 |
| GPIO (max) | 50 |
| I2C | ×3 Master/Slave mode. Max data rate at 400Kbps. |
| SPI | ×3 SPI0: Master + Slave role SPI1: Master only SPI2: Master only |
| Package (mm) | BGA184, 4.9×6 |