Introduction
The RTL8773E is a single-chip Bluetooth SoC audio solution for smart watch applications. The RTL8773E is qualified for Bluetooth 5.4 specifications, and embedded hardware modules include a low-power MCU, a low-power DSP, high-performance audio codec, 2.5D image engine, image decompression unit, power management unit, ADC, ultra-low power RF transceiver, and smart I/O distribution controller.
DESCRIPTION
CHIP
Highlights
2.5D engine supports rendering, scaling, rotating, deforming, and other processing of graphics.
CPU computing power and MCU memory provide sensor algorithms or external device control capabilities.
DSP computing power provides powerful speech and audio processing capabilities.
Includes Bluetooth LE Bluetooth Legacy Audio、LE Audio， Implement product requirements with the latest technology.
Specifications
- Bluetooth 5.4
- RM300F, 100MHz
- HiFi Mini, 200MHz
- 800kByte SRAM
- 0/4/8MByte PSRAM
- 2.5D Graphics Engine
- Audio input/output
- Rich peripheral interfaces
- Bluetooth 5.4
- RM300F, 100MHz
- HiFi Mini, 200MHz
- 800kByte SRAM
- 0/4/8MByte PSRAM
- 2.5D Graphics Engine
- Audio input/output
- Rich peripheral interfaces
Part Number Comparison
Part Number | Flash | PSRAM | Package (mm) | Recommendation Applied |
|---|---|---|---|---|
 RTL8773EWE |  | |||
RTL8773EWE-VP |  | |||
RTL8773EWE-VS |  | |||
RTL8773EKF |  |
Applications
Learn about the typical application cases that the RTL8773E series can be used to implement. Of course, there are more applications waiting for you to discover.
Using a single BT SoC as the main controller for the smartwatch, connecting peripherals through interfaces such as SPIC, I2C, SPI, GPIO, I8080, MIC, DAC, etc., and connecting to a mobile phone via Bluetooth, a highly integrated smartwatch solution is achieved.
Using a single BT SoC as the main controller for the smartwatch, connecting peripherals through interfaces such as SPIC, I2C, SPI, GPIO, I8080, MIC, DAC, etc., and connecting to a mobile phone via Bluetooth, a highly integrated smartwatch solution is achieved.
*Specific applications may can only be supported by certain chips
