Introduction
RTL8783G is a highly integrated Bluetooth/Wi‑Fi audio SoC designed specifically for smartwatches. It supports the latest Bluetooth (LE/Classic, including LE Audio) and Wi‑Fi 4, and integrates a low‑power MCU, Helium vector acceleration, low‑power DSP, high‑performance audio codec, 2.5D graphics engine, JPEG encoder/decoder, PMU, ADC, ultra‑low‑power RF transceiver, and intelligent I/O multiplexing controller. Built on an ultra‑low‑power architecture, it delivers extended battery life while enabling high‑quality voice calls, smooth UI, and stable wireless connectivity.
DESCRIPTION
CHIP
Highlights
Built‑in 2.5D hardware engine efficiently supports core graphics operations including rendering, scaling, rotation, and deformation.
High-performance CPU with neural network acceleration, complemented by ample MCU memory, fully supports sensor algorithm processing and control of various external devices.
High‑efficiency DSP compute that excels in key applications such as speech recognition, noise reduction, and audio quality enhancement.
Built‑in Bluetooth LE/Legacy, LE Audio, Wi‑Fi 4, and IEEE 802.15.4, meeting multi‑scenario connectivity and low‑power needs.
Specifications
- Bluetooth 6.0/BLE Audio
- Wi-Fi4 802.11 b/g/n, 2.4GHz
- IEEE 802.15.4
- CM55 with Helium, 200MHz
- HiFi Mini, 260MHz
- 1.3MByte SRAM
- 16MByte PSRAM
- 10MB Flash
- 75 GPIOs (max)
- 2D/2.5D Image Engine
- JPEG Encoder and Decoder
- LCDC QSPI/OPI, SDR/DTR, 70MHz
- QSPI for SPI NAND, 100MHz
- Keybaord Scanner x 1
- Quadrature Decoder x 2
- Infrared Radiation x 1
- RTC x 1
- Timer x 12
- SPI master x 1, 50MHz
- SPI master x 2, 20MHz
- SPI slave x 1, 10MHz
- I2C x 3
- UART x 6
- Low Power Comparator x 1
- 8-channel, 12bits, 400ksps ADC
- SDIO
- USB2.0 High-Speed Host/Device
- AMIC x 2, PDM x 4, DAC/ClassD x 2, I2S x 2
- Bluetooth 6.0/BLE Audio
- Wi-Fi4 802.11 b/g/n, 2.4GHz
- IEEE 802.15.4
- CM55 with Helium, 200MHz
- HiFi Mini, 260MHz
- 1.3MByte SRAM
- 16MByte PSRAM
- 10MB Flash
- 75 GPIOs (max)
- 2D/2.5D Image Engine
- JPEG Encoder and Decoder
- LCDC QSPI/OPI, SDR/DTR, 70MHz
- QSPI for SPI NAND, 100MHz
- Keybaord Scanner x 1
- Quadrature Decoder x 2
- Infrared Radiation x 1
- RTC x 1
- Timer x 12
- SPI master x 1, 50MHz
- SPI master x 2, 20MHz
- SPI slave x 1, 10MHz
- I2C x 3
- UART x 6
- Low Power Comparator x 1
- 8-channel, 12bits, 400ksps ADC
- SDIO
- USB2.0 High-Speed Host/Device
- AMIC x 2, PDM x 4, DAC/ClassD x 2, I2S x 2
Part Number Comparison
| Part Number | RTL8783GBF |
|---|---|
CPU | CM55 with Helium, 200MHz |
DSP | HiFi mini, 260MHz |
Flash | 10MB |
MCM PSRAM | 16MB |
A-MIC | 2 |
Audio DAC/SPK | 2 |
GPIO | 75 (max) |
FMC/Quad SPI for NOR/NAND | 1 |
SDIO | 1 |
DC/Quad SPI for LCD | 1 |
2D/2.5D | Y |
Package (mm) | BGA180, 6.8×8.8 |
| Applications |  |
Applications
Learn about the typical application cases that the RTL8783G series can be used to implement. Of course, there are more applications waiting for you to discover.
The solution uses a single-chip SoC as the core controller, integrating a power management unit (PMU) and providing diverse interfaces—including GPIO, I2C, SPI, SDIO, MIC, and DAC—for peripheral connectivity. It also supports Bluetooth for smartphone interconnection and Wi‑Fi for network access, forming a highly integrated smartwatch system solution.
The solution uses a single-chip SoC as the core controller, integrating a power management unit (PMU) and providing diverse interfaces—including GPIO, I2C, SPI, SDIO, MIC, and DAC—for peripheral connectivity. It also supports Bluetooth for smartphone interconnection and Wi‑Fi for network access, forming a highly integrated smartwatch system solution.
*Specific applications may can only be supported by certain chips
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