Bluetooth technology, with its wireless and intelligent connectivity features, has significantly enhanced driving comfort, entertainment, and safety, becoming a crucial component of modern smart vehicles. This technology supports functions such as music streaming, hands-free calling, and voice assistant control, providing convenient interaction and audio entertainment during driving.
Realtek Bluetooth chips feature high-quality audio transmission, wireless calling, and human-machine interaction capabilities. The diverse in-vehicle solutions cater to the application needs of different customers.
System Structure
In a typical automotive cockpit system architecture, adding a Bluetooth transceiver can enable the cabin's audio-visual system to support multiple Bluetooth audio streams simultaneously.
This design allows multiple devices to either play the same audio source simultaneously or play different audio sources independently, significantly enhancing the in-vehicle entertainment experience.
Realtek Bluetooth transceiver not only supports dual A2DP (Advanced Audio Distribution Profile) audio sources but also offers extended LE Audio solutions. These are provided through BIS (Broadcast Isochronous Streams) or CIS (Connected Isochronous Streams) modes, enabling LE Audio functionality for in-vehicle entertainment systems.
Application Scenario
Advantages of Solution
Realtek offers a variety of solutions based on the chip type (Bluetooth transceiver or Bluetooth SoC), LE Audio support, and automotive-grade certification, to meet the specification requirements of different in-vehicle application scenarios.
Realtek Bluetooth solutions fully support various technology standards, including Bluetooth LE, Bluetooth Legacy Audio, LE Audio, and Auracast broadcast audio mode. By integrating the latest Bluetooth technologies, these solutions can meet the functional requirements of a wide range of products.
Realtek Bluetooth chip offers comprehensive multi-connection capabilities, which includes the following features:
- Dual-A2DP Source
- Dual-HFP AG
- Dual-SCO
- HID/HOGP Host
- LE Audio two BIS / two CIS
Realtek provides fully-featured SDK/HDK development kits along with accompanying mobile app projects, which can significantly reduce development difficulty and shorten time-to-market.
Recommended Hardware
| RTL8761BTV-VI | RTL8761BTV-VIQ | RTL8761CTV-VI | RTL8761CTV-VIQ | |
|---|---|---|---|---|
| BT Version | BT5.0 | BT5.0 | BT5.3 | BT5.3 |
| Function Highlight | •Dual-A2DP Source •Dual-HFP AG •HID/HOGP Host | •Dual-A2DP Source •Dual-HFP AG •HID/HOGP Host | •Dual-A2DP Source •Dual-HFP AG •Dual-SCO •HID/HOGP Host •LE Audio two BIS/two CIS | •Dual-A2DP Source •Dual-HFP AG •Dual-SCO •HID/HOGP Host •LE Audio two BIS/two CIS |
| Max Tx power | 10dBm | 10dBm | 10dBm | 10dBm |
| Rx Sensitivity | -97dBm | -97dBm | -97dBm | -97dBm |
| Interface | •HCI UART •PCM | •HCI UART •PCM | •HCI UART •I2S/PCM | •HCI UART •I2S/PCM |
| Operation Temperature/Certification | -40~105℃ | •-40~105℃ •AEC-Q100 •Group A,Grade 2 | -40~105℃ | •-40~105℃ •AEC-Q100 •Group A,Grade 2 |
| RTL8763ESE | RTL8763EAV | RTL8763EAV-VI | |
|---|---|---|---|
| BT Version | BT5.3 | BT5.3 | BT5.3 |
| Function Highlight | •Dual-A2DP Source •Dual-HFP AG •Dual-SCO •HID/HOGP Host •On-chip BT host stack | •Dual-A2DP Source •Dual-HFP AG •Dual-SCO •HID/HOGP Host •LE Audio two BIS/two CIS •On-chip BT host stack | •Dual-A2DP Source •Dual-HFP AG •Dual-SCO •HID/HOGP Host •LE Audio two BIS/two CIS •On-chip BT host stack |
| Max Tx power | 10 dBm | 10 dBm | 10 dBm |
| Rx Sensitivity | -97dBm | -97dBm | -97dBm |
| Interface | •UART •I2S/PCM | •UART •I2S/PCM | •UART •I2S/PCM |
| Operation Temperature | -40~85℃ | -40~85℃ | -40~105℃ |
