Applications > Smart Watch

Smart Watch
Smart Watch
Application Overview
Smart Watch

Smart watches are fashionable accessories that integrate cutting-edge technology. They have an exquisite appearance and can be connected to mobile phones to receive notifications, play music, and make calls. They can accurately monitor sports and health data. Adaptable to various life scenarios, they are your intimate companions, making life more intelligent and convenient.

System Structure

Realtek Smart Watch solution based on RTL8773E uses a single BT SoC as the main controller. It connects to peripherals via interfaces such as SPIC, I2C, SPI, GPIO, I8080, MIC, and DAC, and connects to phones via Bluetooth to create a highly integrated smart watch solution.
Realtek provides reference designs, SDK, and toolchains, characterized by high integration and ease of development.

Application Structure

RTL8773G-series smartwatch solution is based on a highly integrated single-chip BT SoC. Compared with the RTL8773E series, it offers a higher-performance MCU and DSP, a Helium vector engine, a 2.5D graphics engine, and JPEG encoding/decoding capabilities, delivering a powerful and feature-rich smartwatch platform.

Application Structure

The RTL8783GBF smartwatch solution is built on the RTL8773G series, with further integration of Wi-Fi, on-chip 64Mbit Flash, and 128Mbit PSRAM, as well as more abundant I/O resources, making it ideal for high-end, feature-rich smartwatch designs.

Application Structure

Application Scenarios

Applications that meet customer needs in various scenarios
Application Scenario
Various Applications

Based on powerful computing and graphics capabilities, the watch can support a variety of applications: map navigation, mini-games, third-party apps, and more.

Multiple audio scenarios supported
Application Scenario
Audio Scenarios

Supports a variety of audio scenarios including mobile music playback, phone calls, local music playback, and music playback through connected headphones.

Real time monitoring during exercise
Application Scenario
Running Monitoring

Monitor step frequency, speed, heart rate, and other information during exercise to provide real-time feedback on exercise and health status.

Advantages of Solution

Application Advantages
Powerful Graphics Processing Capability

A 2.5D hardware graphics engine that supports rendering, scaling, rotating, deforming, and other processing of graphics.

Application Advantages
Powerful CPU Resources

CPU computing power and MCU memory provide sensor algorithms or external device control capabilities.

Application Advantages
Powerful DSP Processing Capability

DSP computing power provides powerful speech and audio processing capabilities.

Application Advantages
Rich Peripheral Interface

Supports interfaces such as GPIO/I2C/SPI/UART/ADC/DAC/MIC/I2S/SPIC/DC, and can be externally connected to a wide range of devices.

Application Advantages
Integrating Multi Mode Bluetooth

Includes Bluetooth LE, Bluetooth Legacy Audio, and LE Audio, Implement product requirements with the latest technology.

Application Advantages
Complete Development Kit

Provide HDK and a fully functional SDK development package that includes complete product prototype engineering, mobile APP SDK, OTA tools, and production tools, reducing customer development work and accelerating project implementation.

Start Implementing My Smart Watch Application

1
Define application requirements

Define the product functionality, focusing on the graphical user interface (GUI), Bluetooth features, and audio requirements.

2
Select the hardware platform

Chip selection: Based on functional requirements, select an appropriate chip solution and evaluate whether its performance, resources, and other parameters meet the needs.

Evaluation board procurement: Purchase the corresponding evaluation boards from online marketplaces to conduct functional evaluation and performance testing, ensuring the hardware platform meets the design requirements.

3
Software development

Apply for SDK resources: Register an account on Anchor and request the SDK documentation and resources.

Application development: Customize and implement the required functionality based on the SDK.

4
Functional testing

Validate that the developed functionality and stability meet the requirements, ensuring the quality of deliverables meets the required standards.

5
Certification and mass production

Certification preparation: Prepare relevant documentation and test reports, and apply for the necessary product certifications (e.g., Bluetooth certification, safety certification).

Mass production preparation: Complete production line setup and testing to ensure quality and consistency in large-scale production.

Recommended Chips

Choose the SoC that suits your design requirements
RTL8773EWE RTL8773EWE-VP RTL8773EWE-VS RTL8773GTP RTL8783GBF
MCU RM300F, 100MHz RM300F, 100MHz RM300F, 100MHz CM55 with Helium, 200MHz CM55 with Helium, 200MHz
DSP HiFi mini, 200MHz HiFi mini, 200MHz HiFi mini, 200MHz HiFi Mini, 260MHz HiFi Mini, 260MHz
Flash Ext. Ext. Ext. Ext. 10MB
SRAM 800KB 800KB 800KB 928KB 1.3MB
PSRAM N 4MB 8MB 8MB 16MB
Bluetooth Version Bluetooth 5.3 Bluetooth 5.3 Bluetooth 5.3 Bluetooth 6.0 Bluetooth 6.0
Tx power +13dBm +13dBm +13dBm +13dBm BT: +13dBm WIFI: +18dBm
RX sensitivity -95.8dBm (1M BR) -95.6dBm (2M EDR) -100.6dBm (1M BLE) -96.5dBm (2M BLE) -95.8dBm (1M BR) -95.6dBm (2M EDR) -100.6dBm (1M BLE) -96.5dBm (2M BLE) -95.8dBm (1M BR) -95.6dBm (2M EDR) -100.6dBm (1M BLE) -96.5dBm (2M BLE) -95.5dBm (1M BR) -95.5dBm (2M EDR) -100.5dBm (1M BLE) -96.5dBm (2M BLE) -95.5dBm (1M BR) -95.5dBm (2M EDR) -100.5dBm (1M BLE) -96.5dBm (2M BLE)
Display Controller QSPI/OPI: SDR 60MHz, DDR 40MHz QSPI/OPI: SDR 60MHz, DDR 40MHz QSPI/OPI: SDR 60MHz, DDR 40MHz SPI SDR 70MHz QSPI/OPI: SDR/DDR 70MHz RAMless QPI SDR/DTR 70MHz I8080 SDR 40MHz SPI SDR 70MHz QSPI/OPI: SDR/DDR 70MHz RAMless QPI SDR/DTR 70MHz I8080 SDR 40MHz
AMIC 2 2 2 2 2
DAC 1 1 1 1 2
GPIO (max) 38 38 38 36 75
I2C 3 3 3 3 3
UART 3 3 3 6 6
SPI Master×3, 10MHz Slave×1, 10MHz Master×3, 10MHz Slave×1, 10MHz Master×3, 10MHz Slave×1, 10MHz Master×1, 50MHz Master×1, 20MHz Master×1, 10MHz Slave×1, 10MHz Master×1, 50MHz Master×2, 20MHz Slave×1, 10MHz
SPIC 1, 80MHz 1, 80MHz 1, 80MHz 1, 100MHz 1, 100MHz
Package (mm) QFN68, 7×7 QFN68, 7×7 QFN68, 7×7 QFN68, 7×7 BGA180, 6.8×8.8
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