Media > Realtek Unveils Next-Gen Smart Connectivity and AI Platforms at Embedded World 2026

Realtek Semiconductor Corporation will present a focused portfolio of intelligent connectivity and Bluetooth innovations at Embedded World 2026, showcasing how its latest platforms are enabling an AI driven, hyper connected future across smart home, industrial, mobility, audio, retail, and broader IoT applications.

At the heart of the smart home showcase is Realtek’s Thread Open Thread Border Router (OTBR) solution, built around the RTL8772GWP, the world’s first Ethernet interface Thread OTBR. By enabling Matter over Thread with both Ethernet and Wi-Fi backhaul options and requiring no hardware changes to existing Wi-Fi access points or OTT boxes, this solution completes the last mile of smart home connectivity for OEMs seeking fast, low risk deployment of Matter ecosystems.

For human–machine interfaces (HMI), Realtek will highlight its Smart HMI knob display solution featuring a 2.1 inch circular OLED with Bluetooth LE, Mesh, Thread, and OTBR support. Powered by the RTL8772GWP and RTL8773EWP, it delivers high resolution rotary knob and touchscreen control with low latency wireless connectivity. Designed for smart home appliances and intelligent control, this Smart HMI platform enables sleek, intuitive user experiences that elevate everyday interactions.

In the smart retail segment, Realtek will present its ESL Access Point and tags solution based on the RTL8752H, supporting Bluetooth LE, IEEE 802.15.4, and proprietary 2.4 GHz modes. With high RF performance, ultra-low power operation, ample system resources, and concurrent 15.4 and Bluetooth LE, the platform is optimized for high density ESL deployments. A fast group update protocol further minimizes tag update time, enhancing responsiveness in large scale installations.

For next generation vehicle and micro mobility experiences, Realtek will feature its all in one smart cluster platform based on the RTL8782FWP and RTL8763ESE. This solution integrates Wi-Fi 6, Bluetooth audio, MCU processing, graphics, and DSP to enable full screen smartphone mirroring, dual helmet audio sharing, intercom, smart keyless access, and vehicle data integration. Realtek will also showcase its audio mesh intercom solution for helmets and group communication, built on SoCs such as RTL8763E, RTL8773D, and RTL87x3J, which supports long range, low latency multi party intercom with up to six digital microphones and voice activity detection for safe, convenient real time communication in demanding outdoor environments.

Realtek will further showcase its Zephyr SDK for RTL87x2G, RTL8752H, and RTL87x3G, compatible with Zephyr v3.7 LTS and progressing toward mainline support in Zephyr v4.4, to accelerate development of keyboards, mesh devices, wearables, and broader IoT products. The downstream SDK delivers optimized drivers, power management, Bluetooth LE, Classic Bluetooth, and OTA capabilities, and will be demonstrated through reference designs including a Bluetooth mesh platform with multiple USB dongles, a high performance mechanical keyboard, and a smartwatch evaluation board with AMOLED display and integrated Wi-Fi.

In parallel, Realtek’s AI Pen system architecture brings edge AI, audio capture, and cloud connectivity into an ultra-compact form factor, offering two chip and single chip configurations that combine Bluetooth SoCs such as RTL8763EW, RTL8773DO, and RTL8783G with Wi-Fi, OLED displays, bone sensors, microphones, and high speed storage to enable advanced note taking, voice capture, and AI assisted experiences in portable devices.

Rounding out the booth is Realtek’s Bluetooth HDT (High Data Throughput) platform, featuring the RTL8922D, the world’s first HDT combo chip, and the RTL8773J, the world’s first HDT audio SoC. Building on LE Coded and LE 2M PHYs, it introduces an enhanced packet and scheduling architecture that delivers approximately 80–90 percent on air utilization, multi stream transmission, and low latency, low jitter performance. This enables ~10 ms gaming audio, multi channel 7.1 surround sound, high resolution music, high fidelity microphones, and up to three times faster OTA updates, while the RTL8773J + RTL8762J “all in one” dongle architecture powers next generation gaming headsets and 4K/8K HID peripherals.

Across all these demonstrations, Realtek Bluetooth’s presence at Embedded World 2026 underscores its role in powering the intelligent connected world with tightly integrated silicon, software, and reference designs that shorten time to market for smart home, retail, mobility, audio, wearable, and IoT applications. It also reaffirms the company’s commitment to delivering scalable, high performance connectivity platforms that enable customers and partners to accelerate their AI ready product roadmaps.