Products > RTL8763G/RTL8773G Series

RTL8763G/RTL8773G Series
RTL8763G/RTL8773G Series

Introduction

RTL8763G/RTL8773G is a single‑chip Bluetooth audio SoC solution designed for devices such as smartwatches, speakers, and headphones. Its wireless subsystem supports the latest Bluetooth specifications and IEEE 802.15.4, and integrates a low‑power MCU, Helium vector processing unit, low‑power DSP, high‑performance audio codec, 2.5D graphics engine, JPEG encoder/decoder, power management unit (PMU), ADC, an ultra‑low‑power RF transceiver, and an intelligent I/O multiplexing controller. Built on an ultra‑low‑power architecture, it delivers long battery life while providing high‑quality calls, smooth UI, and stable connectivity.

DESCRIPTION

CHIP

Highlights

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Powerful Graphics Processing

Built‑in 2.5D hardware engine efficiently supports core graphics operations including rendering, scaling, rotation, and deformation.

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Powerful Compute Resources

High-performance CPU with neural network acceleration, complemented by ample MCU memory, fully supports sensor algorithm processing and control of various external devices.

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Powerful Audio Processing

High‑efficiency DSP compute that excels in key applications such as speech recognition, noise reduction, and audio quality enhancement.

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Comprehensive Wireless Integration

Built‑in Bluetooth LE/Legacy, LE Audio and IEEE 802.15.4, meeting multi‑scenario connectivity and low‑power needs.

Specifications

General Description
  • Bluetooth 6.0/BLE Audio
  • IEEE 802.15.4
MCU/DSP Platform
  • CM55 with Helium, 200MHz
  • HiFi Mini, 260MHz
  • 928kByte SRAM
  • 4MB/8MByte PSRAM
  • External  Flash
Peripheral Interface
  • 36 GPIOs (max)
  • 2D/2.5D Image Engine
  • JPEG Encoder and Decoder
  • LCDC QSPI/OPI, SDR/DTR, 70MHz
  • QSPI for SPI NAND, 100MHz
  • Keybaord Scanner × 1
  • Quadrature Decoder × 2
  • Infrared Radiation × 1
  • RTC × 1
  • Timer × 12
  • SPI master × 1, 50MHz
  • SPI master × 2, 20MHz
  • SPI slave × 1, 10MHz
  • I2C × 3
  • UART × 6
  • Low Power Comparator × 1
  • 4-channel, 12bits, 400ksps ADC
  • SDIO × 2
  • AMIC × 2, PDM × 4, DAC × 2, I2S × 2
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RTL8763G/RTL8773G Series

General Description
  • Bluetooth 6.0/BLE Audio
  • IEEE 802.15.4
MCU/DSP Platform
  • CM55 with Helium, 200MHz
  • HiFi Mini, 260MHz
  • 928kByte SRAM
  • 4MB/8MByte PSRAM
  • External  Flash
Peripheral Interface
  • 36 GPIOs (max)
  • 2D/2.5D Image Engine
  • JPEG Encoder and Decoder
  • LCDC QSPI/OPI, SDR/DTR, 70MHz
  • QSPI for SPI NAND, 100MHz
  • Keybaord Scanner × 1
  • Quadrature Decoder × 2
  • Infrared Radiation × 1
  • RTC × 1
  • Timer × 12
  • SPI master × 1, 50MHz
  • SPI master × 2, 20MHz
  • SPI slave × 1, 10MHz
  • I2C × 3
  • UART × 6
  • Low Power Comparator × 1
  • 4-channel, 12bits, 400ksps ADC
  • SDIO × 2
  • AMIC × 2, PDM × 4, DAC × 2, I2S × 2

Part Number Comparison

Part Number
RTL8773GTP
RTL8773GTP-VA5

CPU

CM55 with Helium, 200MHz

CM55 with Helium, 200MHz

DSP

HiFi mini, 260MHz

HiFi mini, 260MHz

Flash

External

External

MCM PSRAM

8MB

4MB

A-MIC

2

2

Audio DAC/SPK

2

2

GPIO

36

36

FMC/Quad SPI for NOR/NAND

2

2

SDIO

2

2

DC/Quad SPI for LCD

1

1

2D/2.5D

Y

Y

Package (mm)

QFN68, 7×7

QFN68, 7×7

Applications

Learn about the typical application cases that the RTL8763G/RTL8773G series can be used to implement. Of course, there are more applications waiting for you to discover.

Smart Watch Solution
Smart Watch Solution

The solution uses a single-chip SoC as the core controller, integrating a power management unit (PMU) and providing diverse interfaces—including GPIO, I2C, SPI, SDIO, MIC, and DAC—for peripheral connectivity. It also supports Bluetooth for smartphone interconnection, forming a highly integrated smartwatch system solution.

Smart Watch Solution
Smart Watch Solution

The solution uses a single-chip SoC as the core controller, integrating a power management unit (PMU) and providing diverse interfaces—including GPIO, I2C, SPI, SDIO, MIC, and DAC—for peripheral connectivity. It also supports Bluetooth for smartphone interconnection, forming a highly integrated smartwatch system solution.

*Specific applications may can only be supported by certain chips