Products > RTL8773J Series
Introduction
The RTL8773J Series is an advanced audio solution for next-generation applications, offering exceptional power efficiency and performance. Its multi-core architecture features dual HiFi1s-VFPU DSPs—the primary DSP for high-fidelity codec processing and a low-power, low-latency secondary platform with Hyden accelerator for ANC, Talk Clear, and Keyword Spotting. The CM55F-MVE main processor and CM33F sensor/network processor ensure seamless low-latency operation. Supporting Bluetooth 7.x and proprietary 2.4 GHz protocols, the RTL8773J includes a high-performance codec and integrated PMU, delivering superior audio quality, ultra-low latency, and efficient mixing via HDT technology. With extensive peripheral support, it's ideal for TWS earbuds, gaming headsets, 3-in-1 dongles, speakers, controllers, and AI smart glasses.
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Highlights
Features advanced Bluetooth 7.0 dual-mode (Classic + LE Audio) with full backward compatibility. HDT technology enables up to 7.5Mbps data transfer, effortlessly handling 24-bit/96kHz Hi-Res and lossless audio. Experience wire-free listening with zero compression—audio quality that rivals wired connections.
High-performance quad-core architecture meets smart power efficiency. Dynamic memory allocation and optimized power management automatically scale performance to workload, enabling ultra-low power consumption during light tasks. Enjoy longer battery life in compact wearables—no performance compromises required.
Break through RF interference barriers with cutting-edge Forward Error Correction technology. Our intelligent system instantly repairs damaged packets during high-speed transfers, dramatically reducing retries. Enjoy superior bandwidth efficiency, extended battery life, and unwavering connection stability—no matter how crowded the airwaves get.
AI meets privacy in our highly integrated audio SoC. Haydn and FFT AI accelerators combined with ARM MVE technology enable powerful on-device voice/gesture recognition and object classification—all without cloud connectivity. Experience instant response times and absolute data privacy, perfect for smart healthcare and environmental monitoring.
Advanced hardware watchdog enables microsecond-level mode switching based on precise system state detection. Maximizes sleep time during idle periods for ultimate power efficiency—every milliwatt counts.
Equipped with fast USB and SD Card ports for effortless external storage and high-volume data exchange. Adaptable interfaces serve everything from consumer gadgets to industrial systems Built-in SPI interface with LCD and screen mirroring turns wearables into complete display terminals. —one platform, unlimited possibilities.
Next-gen AI meets multi-core power: simultaneous ANC, ENC, and AI scene recognition without compromise. Real-time voice separation locks onto front-facing speakers while suppressing ambient noise and background conversations. AI Talk Clear with Zero Delay technology ensures you hear what matters—perfect calls, perfect listening.
Specifications
- Bluetooth 6.2 core specification
- Bluetooth Pre 7.x features
- BR/EDR/LE-1M/LE-2M/LE Coded (Long Range)
- AoA/AoD
- LE audio
- HDT/Realtek-HDT+
- Channel Sounding
- Short connection interval (SCI ) 1.25ms
- Frame Space Update supports a negotiable frame space shorter or longer than 150us
- 2.4GHz proprietary protocol
- OTA (Over-the-Air) FW upgrade
- Support speaker out
- Analog mic input
- Digital mic input
- Built-in LDO for the I/O and FLASH memory
- Built-in Li-Ion battery charger with up to 500mA charger current
- Dual core ARM CM33 w/ FPU , CM55 w/MVE, max clk rate 200MHz
- Dual core DSP HiFi 1s, max clk rate 400MHz
- HW FFT engine
- 2MB SRAM total (including core-dedicated RAM + 1024KB shared configurable SRAM)
- Crypto engine: AES 128/256, SHA256/384, PKE (RSA-4096/ECC P-384)
- 4MB/8MB/16MB embedded Flash (part number dependent)
- 8MB embedded PSRAM (part number dependent)
- Max Tx Power 15 dBm @BLE (refer to datasheet for details)
- Max Tx Power 12 dBm @EDR 2M (refer to datasheet for details)
- RX sensitivity -101 dBm (1M BLE)
- RX sensitivity -97 dBm (1M BR)
- RX sensitivity -97 dBm (2M EDR)
- RS-FEC : cutting-edge Forward Error Correction technology
- Fast AGC control to improve receiving dynamic range
- SBC codec
- mSBC codec
- LC3 codec (depends on part number)
- LC3Plus codec (depends on part number)
- OPUS codec (depends on part number)
- Flexible GPIO Design
- max 8 CH 12 bits ADC
- USB 2.0 (depends on part numbers)
- I2C
- I2S
- UART
- Line in, L/R channel
- SPI
- PDM interface (for digital mic input)
- PWM
- SDIO (depends on part numbers)
- SPIC (QSPI) (depends on part numbers)
- Available GPIOs: 13~30 pins (depend on part numbers)
- Bluetooth 6.2 core specification
- Bluetooth Pre 7.x features
- BR/EDR/LE-1M/LE-2M/LE Coded (Long Range)
- AoA/AoD
- LE audio
- HDT/Realtek-HDT+
- Channel Sounding
- Short connection interval (SCI ) 1.25ms
- Frame Space Update supports a negotiable frame space shorter or longer than 150us
- 2.4GHz proprietary protocol
- OTA (Over-the-Air) FW upgrade
- Support speaker out
- Analog mic input
- Digital mic input
- Built-in LDO for the I/O and FLASH memory
- Built-in Li-Ion battery charger with up to 500mA charger current
- Dual core ARM CM33 w/ FPU , CM55 w/MVE, max clk rate 200MHz
- Dual core DSP HiFi 1s, max clk rate 400MHz
- HW FFT engine
- 2MB SRAM total (including core-dedicated RAM + 1024KB shared configurable SRAM)
- Crypto engine: AES 128/256, SHA256/384, PKE (RSA-4096/ECC P-384)
- 4MB/8MB/16MB embedded Flash (part number dependent)
- 8MB embedded PSRAM (part number dependent)
- Max Tx Power 15 dBm @BLE (refer to datasheet for details)
- Max Tx Power 12 dBm @EDR 2M (refer to datasheet for details)
- RX sensitivity -101 dBm (1M BLE)
- RX sensitivity -97 dBm (1M BR)
- RX sensitivity -97 dBm (2M EDR)
- RS-FEC : cutting-edge Forward Error Correction technology
- Fast AGC control to improve receiving dynamic range
- SBC codec
- mSBC codec
- LC3 codec (depends on part number)
- LC3Plus codec (depends on part number)
- OPUS codec (depends on part number)
- Flexible GPIO Design
- max 8 CH 12 bits ADC
- USB 2.0 (depends on part numbers)
- I2C
- I2S
- UART
- Line in, L/R channel
- SPI
- PDM interface (for digital mic input)
- PWM
- SDIO (depends on part numbers)
- SPIC (QSPI) (depends on part numbers)
- Available GPIOs: 13~30 pins (depend on part numbers)
Part Number Comparison
| Part Number | RTL8763JKU | RTL8773JKE | RTL8773JBM | RTL8773JBS |
|---|---|---|---|---|
MCU | CM33F+CM55F MVE @200MHz | CM33F+CM55F MVE @200MHz | CM33F+CM55F MVE @200MHz | CM33F+CM55F MVE @200MHz |
DSP | dual DSP Hifi 1s @360MHz | dual DSP Hifi 1s @360MHz | dual DSP Hifi 1s @360MHz | dual DSP Hifi 1s @360MHz |
HDT/R-HDT+ | Y | N | Y | Y |
2.4G Proprietary | Y | N | Y | Y |
Channel Sounding | O | N | O | O |
AI Talk Clear with Zero Delay | N | N | N | Y |
MCM Flash | 4MB | 4MB | 8MB | 16MB |
MCM PSRAM | N | N | N | 8MB |
BLE Audio | Y | Y | Y | Y |
A-MIC Number | ×3 | ×3 | ×3 | ×3 |
D-MIC | ×6 | ×6 | ×10 | ×10 |
ANC | N | adaptive ANC | adaptive ANC | adaptive ANC |
GPIO (max) | 13 | 16 | 30 | 30 |
SDIO | N | N | Y | Y |
USB | Y | N | Y | Y |
Package (mm) | QFN52, 4.1×6.4 | QFN52, 4.1×6.4 | BGA108, 4.2×5.9 | BGA108, 4.2×5.9 |
| Applications |  |   |      |     |
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