• Dual cores: Real-M300 and KR4
• Real-M300：
  ◦Arm Cortex-M55 compatible instruction set
  ◦Running at a frequency of up to 400MHz
  ◦16KB 4-way I-Cache, 16KB 4-way D-Cache
• KR4：
  ◦RISC-V compatible instruction set
  ◦Running at a frequency of up to 400MHz
  ◦16KB 4-way I-Cache, 16KB 4-way D-Cache
• Memory:
  ◦768KB on-chip SRAM
  ◦Embedded DQ8 PSRAM, up to 200MHz
  ◦Supports QSPI Flash, up to 100MHz

• Secure boot
• Arm TrustZone-M
• True Random Number Generator (TRNG)
• Hardware crypto engine
• ECDSA engine
• Whole or partial Flash encryption
• Read Protection (RDP)
• JTAG/SWD password protection/forbidden
• 2K bytes OTP, up to 2K bits for users

• Flexible design of GPIO configuration
• Multi-communication interfaces: SPI x 2, UART x 5, I2C x 2
• Supports Real-Time Clock timer together with 15 timers
• Supports 8 channels of PWM timer and 1 capture timer
• Supports 6 channels of general 12-bit ADC
• Supports 9 channels of touch pad
• Supports 8 independent channels of GDMA
• Embeds a serial LEDC to control the external LED lamps
• Integrates a thermal detector to detect and monitor the real-time temperature inside the chip
• Integrated hardware crypto engine supports AES/SHA/ECDSA
• Integrated SPI Flash controller and PSRAM controller
• Integrated Audio Codec: 4 channels DMIC and 1 channel PDM out
• I2S x 2: up to 384kHz sampling rate

Wi-Fi

• 802.11 b/g/n/ax 1 x 1, 2.4GHz
• Supports MCS0 - MCS9 20MHz bandwidth
• Supports antenna diversity
• Tx Power:
  ◦11b 11Mbps: 20dBm
  ◦11g 54Mbps: 19dBm (EVM < −25dB)
  ◦11n MCS7-HT20: 18dBm (EVM < −27dB)
  ◦11ax MCS9-HE20: 16dBm (EVM < −32dB)
• Rx Sensitivity:
  ◦11b 11Mbps: −91dBm
  ◦11g 54Mbps: −78dBm
  ◦11n MCS7-HT20: −76.5dBm
  ◦11ax MCS9-HE20: −70.5dBm

BT

• Supports BLE 5.2
• Supports both 500kbps and 125kbps LE-Coded PHY (long range)
• Supports scatter-net (concurrent central mode and peripheral mode)
• Supports SIG Mesh v1.0 and v1.1
• Supports AoA and AoD