Media > Realtek Collaborates with Rohde & Schwarz to Complete Industry’s First End-to-End Test Solution for Bluetooth® LE High Data Throughput (HDT)

Realtek Semiconductor and Rohde & Schwarz, a global leader in test and measurement, have successfully validated the industry’s first end-to-end test solution for the next-generation Bluetooth® LE High Data Throughput (HDT) feature, marking a critical milestone from standard definition to mass-production readiness. Leveraging the Rohde & Schwarz CMP180 radio communication tester, the two partners have completed full characterization and rigorous validation of Realtek’s next-generation Bluetooth solutions, the RTL8922D and RTL8773J, delivering a one-stop verification capability spanning R&D, pre-conformance, and high-volume manufacturing.

As a cornerstone enhancement of next-generation Bluetooth LE, Bluetooth LE HDT lifts the peak data rate from 2 Mbps up to 7.5 Mbps, while maintaining low-power advantages. It delivers up to 4x higher capacity, improved energy efficiency, better spectrum efficiency, and stronger link reliability. The new Bluetooth LE PHY supports five configurable data rates between 2 and 7.5 Mbps through three new modulation schemes and multi-level forward error correction (FEC), enabling transformative use cases including low-latency high-definition audio streaming, fast media/file sharing, and accelerated over-the-air (OTA) firmware updates.

Realtek launches two HDT-enabled next-generation chips to form a complete platform for wireless connectivity and professional audio:

• RTL8922D: A high-performance Wi-Fi/Bluetooth combo chip integrating HDT, channel sounding, and IEEE 802.15.4. It enables simultaneous and stable operation of Wi-Fi, dual Bluetooth links, and Zigbee/Thread connectivity, ideal for PCs, TVs, gaming devices, automotive systems, and smart home devices.
• RTL8773J: A dedicated Bluetooth audio SoC that unifies BT Legacy, Bluetooth LE, LE Audio, and HDT in a single design. Built on an energy-efficient architecture, it enables ultra-low-latency audio processing and greatly improves robustness and interference resistance for HDT transmission, ideal for TWS earbuds, speakers, conference microphones, and other intelligent audio products.

The Rohde & Schwarz CMP180 radio communication tester serves as the core test platform for this HDT verification, covering full R&D, pre-conformance, and mass-production test needs. It is future-ready to support higher-frequency Bluetooth LE enhancements and excels at multi-technology, multi-device parallel testing. Beyond Bluetooth, the CMP180 supports Wi-Fi 8, 5G NR FR1 up to 8 GHz with bandwidths up to 500 MHz, and features dual analyzers, dual generators, and two sets of eight RF ports. It supports Bluetooth LE Direct Test Mode (DTM), chipset-specific control, and the upcoming Universal Test Protocol (UTP), providing a highly integrated, cost-effective test platform for current and next-generation wireless technologies.

Yee-Wei Huang, Vice President and Spokesman of Realtek Semiconductor, stated: “We are grateful for the close collaboration with Realtek Semiconductors on the upcoming Bluetooth® LE features to demonstrate the unique capabilities of the CMP180 over the entire product life cycle. Our experience in wireless device testing and this early cooperation with Realtek allow us to provide best-in-class test solutions for our customers.”

Goce Talaganov, Vice President of Mobile Radio Testers at Rohde & Schwarz, commented: “Bluetooth LE High Data Throughput is a key enabler for the next wave of immersive audio and seamless connectivity experiences. By combining our RTL8922D Wi Fi/Bluetooth combo chip and RTL8773J Bluetooth audio SoC with the CMP180 test platform from Rohde & Schwarz, we can help our customers bring HDT ready products to market faster, with proven performance from R&D through mass production.”

The solution was previously demonstrated by both companies at MWC Barcelona 2026 and embedded world 2026 in Nuremberg, and is now available for customer deployment.

About Realtek

Realtek Semiconductor Corp. is one of the world’s leading IC providers. Realtek designs and develops a wide range of IC products for communications network, computer peripheral, and multimedia applications. Products include 10/100/1000M Ethernet Controllers/PHYs, 10/100/1000M Ethernet Switch Controllers/Media Converter Controllers/Gateway Controllers, Wireless LAN Controllers & AP/Router SoCs, DSL Chips, VoIP Solutions, IoT Solutions, High Fidelity Audio Solutions for Mobile and PC Applications, Clock Generators, Card Reader Controllers, Web Camera Controllers, LCD Monitor/ATV/DTV Controllers, and Digital Home Center Controllers. With advanced design expertise in RF, analog, and mixed signal circuits, and with strong manufacturing and system knowledge, Realtek offers full-featured, high-performance, and competitive total solutions. More information on Realtek can be found on our website: www.realtek.com.

Rohde & Schwarz

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For over 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company's leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 3.16 billion in the 2024/2025 fiscal year (July to June). On June 30, 2025, Rohde & Schwarz had more than 15,000 employees worldwide.